8 layers of Black Oil Sinking Gold Thick Copper Plate PCB
An 8-layer black solder mask immersion gold PCB is a high-density integrated circuit board composed of 8 copper circuit layers separated by insulating prepreg, bonded via high-temperature and high-pressure lamination. Its surface is coated with a black solder mask layer to protect copper traces from oxidation and corrosion, while the immersion gold finish ensures excellent solderability, electrical conductivity and anti-tarnish performance. Vias (through, blind, buried) realize reliable interlayer connections.
Core Advantages of Black Solder Mask Immersion Gold Multilayer PCBs vs. Conventional PCBs
| Comparison Aspect | Black Solder Mask Immersion Gold Multilayer PCBs | Conventional PCBs (Green Mask/HASL Finish) |
| Surface Protection | Superior oxidation, corrosion and abrasion resistance; gold finish prevents tarnishing for long service life | Basic protection; HASL finish prone to oxidation and tin whisker formation |
| Electrical Performance |
Low contact resistance; stable signal transmission for high-frequency, high-precision applications | Higher signal loss; poor anti-interference ability in complex circuits |
| Solderability | Uniform gold coating ensures reliable solder joints with minimal defects | Uneven HASL coating leads to cold joints or bridging risks |
| Aesthetics & Defect Concealment | Sleek black mask hides minor surface flaws for a premium look | Green mask highlights scratches and residual copper defects |
| Environmental Adaptability | Resistant to humidity, temperature fluctuations and harsh industrial conditions | Vulnerable to performance degradation in extreme environments |
Standardized Requirements for the Customization of Multi-layer PCB
Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
Tip:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.
Production Process of Black Solder Mask Immersion Gold Multilayer PCBs
1. Fabricate inner circuit layers, inspect defects via AOI, then stack and laminate with prepreg under high temperature and pressure.
2. Drill through/blind/buried vias, plate copper on via walls and surfaces to ensure interlayer conductivity.
3. Transfer and etch outer circuit patterns, then apply black solder mask and cure it.
4. Perform immersion gold finish on pad areas to enhance solderability and corrosion resistance.
5. Conduct electrical testing (e.g., flying probe test) and shape cutting before final quality inspection.
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